法国X-REL半导体Package Outlines
来源:法国X-REL半导体官网 | 作者:spacelt | 发布时间: 2010-07-20 | 5093 次浏览 | 分享到:
PACKAGING INFORMATION
Part Naming and Marking Codes

Structure of part naming code


Part marking code
Part Naming and Marking Codes
Part Reference: XTRNNNNN
XTR X-REL Semiconductor, high-temperature, high-reliability product (XTRM Series -60°C to +230°C).
XER X-REL Semiconductor, extended temperature, high-reliability product (XTRA Series -60°C to +175°C)
NNNNN Part number (0-9, A-Z).
P Package type.
BD – Bare die
D – Dual-in-line (DIP)
S – Small outline (SOIC)
T – Transistor outline (TO)
Unique Lot Assembly Code: YYWWANN
YY Two last digits of assembly year (e.g. 11 = 2011).
WW Assembly week (01 to 52).
A Assembly location code.
NN Assembly lot code (01 to 99).
Example of part naming and marking:

XTR30011-S
Part name 30011 from XTRM series. Assembled in week 32 of year 2011 in assembly location B with assembly lot number 25.