半导体封装信息:封装术语
Package Terminology
BGA
Ball Grid Array
CBGA
Ceramic Ball Grid Array
CDIP
Glass-Sealed Ceramic Dual In-Line Package
CDIP SB
Side-Braze Ceramic Dual In-Line Package
CFP
Both Formed and Unformed CFP
CPGA
Ceramic Pin Grid Array
CZIP
Ceramic Zig-Zag Package
Description
Description of package type.
DFP
Dual Flat Package
FC/CSP
Flip Chip / Chip Scale Package
HLQFP
Thermally Enhanced Low Profile QFP
HQFP
Thermally Enhanced Quad Flat Package
HSOP
Thermally Enhanced Small-Outline Package
HTQFP
Thermally Enhanced Thin Quad Flat Pack
HTSSOP
Thermally Enhanced Thin Shrink Small-Outline Package
HVQFP
Thermally Enhanced Very Thin Quad Flat Package
JEDEC
The JEDEC Standard for this package type.
JLCC
J-Leaded Ceramic or Metal Chip Carrier
LCCC
Leadless Ceramic Chip Carrier
Length
The length of the device (in millimeters).
LGA
Land Grid Array
LQFP
Low Profile Quad Flat Pack
Maximum Height
The maximum height above board surface form (in millimeters).
PDIP
Plastic Dual-In-Line Package
PFM
Plastic Flange Mount Package
Pkg
Package designator code used in Texas Instruments part numbers. The link from the Pkg code goes to the package mechanical drawing in PDF format. Each of the PDF files is between 30K and 50K Bytes.
Pins
The number of pins or terminals on the package.
Pitch
The distance between the centers of adjacent pins (in millimeters).
Preference Code
P
|
- Preferred Package. Package is qualified and orderable.
|
OK
|
- Use if a preferred package is not available
|
A
|
- Requires department/business unit approval.
|
N
|
- Not recommended for new designs.
|
X
|
- Do not use. No longer supported. Not qualified. No longer tooled.
|
QFP
Quad Flat Package
SIP
Single-In-Line Package
SOJ
J-Leaded Small-Outline Package
SOP
Small-Outline Package (Japan)
SSOP
Shrink Small-Outline Package
TFP
Triple Flat Pack
TO/SOT
Cylindrical Package
TQFP
Thin Quad Flat Package
TSSOP
Thin Shrink Small-Outline Package
TVFLGA
Thin Very-Fine Land Grid Array
TVSOP
Very Thin Small-Outline Package
Thickness
The maximum thickness of the package body (in millimeters).
Type
The abbreviated acronymn for this type of package.
VQFP
Very Thin Quad Flat Package
Width
The width of the device (in millimeters).
*Additional types used in Package Designator Tables - These all are marked "DO NOT USE."
DIMM*
Dual-In-Line Memory Module
HSSOP*
Thermally Enhanced Shrink Small-Outline Package
LPCC*
Leadless Plastic Chip Carrier
MCM*
Multi-Chip Module
MQFP*
Metal Quad Flat Package
OPTO*
Light Sensor Package
PLCC*
Plastic Leaded Chip Carrier
PPGA*
Plastic Pin Grid Array
SDIP*
Shrink Dual-In-Line Package
SIMM*
Single-In-Line Memory Module
SODIMM*
Small Outline Dual-In-Line Memory Module
TSOP*
Thin Small-Outline Package
VSOP*
Very Small Outline Package
XCEPT*
Exceptions - May not be a real Package
详情请联系中航力拓电子 工程部